Trenched Circuit Board Technology for Ultra HDI

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Catlam is a patented PCB technology developed by Sierra Circuits, Inc. This new 'trenched circuit board' eliminates etching from the fabrication process and produces sub-3mil trace/space in a reliable, consistent and cost-effective manner.

Traditional Printed Circuit Board


Trenched Circuit Board


• Uneven surface


• Uneven solder mask thickness


• Lack of adhesion for fine lines


• Blind via aspect ratio .75:1


• 4 mil laser drill, 8 mil pad


• Over & under etching creates plating non-uniformity


• Problems with resist, resolution, adhesion development


• 20 layer board, 92 mils thick


• Flat Surface


• Even solder mask thickness


• No adhesion problem - trace is in the laminate


• Blind Via aspect ratio is 1:1


• 2.5 mil laser drill, 3.5 mil pad


• Uniform electroless plating up to .5 oz


• No resist, no etching (makes isolated features possible)


•  20 layer board, 62 mils thick


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